1. During reflow soldering, the components are not directly immersed in the molten solder in the process of electronic processing, so the thermal shock to the components is small (because of the different heating methods, the thermal stress applied to the components will be relatively large in some cases).

2. The application amount of solder can be controlled in the leading process, which reduces welding defects such as virtual welding and bridging, so the welding quality is good, the consistency of the solder joints is good, and the reliability is high.

3. If the position of the solder on the PCB in the previous process is correct and the position of the components is violated, during the reflow process, when all the solder ends, pins and corresponding pads of the components are wet together, due to the effect of the surface tension of the molten solder, a self-positioning effect occurs, and the error can be automatically corrected to pull the components back to an approximately correct position.

4. The solder for reflow soldering is a commercial solder paste, which can ensure the correct composition and generally will not be mixed with impurities.

5. The local heating heat source can be used, so different welding methods can be used for welding on the same substrate.

6. The process is simple, and the workload of repairing is very small.