PCB circuit boards are widely used in China, and pollutants will be generated during the manufacturing process of printed circuit boards, including dust and debris in the manufacturing process such as flux and adhesive residues. If the pcb board cannot effectively ensure a clean surface, resistance and leakage will cause the pcb circuit board to fail, thus affecting the service life of the product. Therefore, cleaning the pcb circuit board is an important step in the manufacturing process.

Semi-aqueous cleaning mainly uses organic solvents and deionized water, plus a certain amount of active agents and additives. This cleaning is between solvent cleaning and water cleaning. These cleaning agents are organic solvents, flammable solvents, high flash point, low toxicity, and safe to use, but they must be rinsed with water and then dried.

Water purification technology is the development direction of future cleaning technology, and it is necessary to establish pure water source and discharge water treatment workshops. Water is used as the cleaning medium, and surfactants, additives, corrosion inhibitors and chelating agents are added to the water to form a series of water-based cleaning agents. Capable of removing aqueous solvents and non-polar contaminants.

It is used in the soldering process without cleaning flux or solder paste. After soldering, it will go directly to the next process for cleaning. No more free cleaning technology is currently the most commonly used alternative technology, especially for mobile communication products, which are basically one-time use instead of ODS. Solvent cleaning is mainly used for solvent dissolution to remove pollutants. Solvent cleaning requires simple equipment due to its fast evaporation and strong solubility.

The above four cleaning techniques can all achieve a certain cleaning effect, but how to clean the PCB board quickly and effectively? The use of ultrasonic cleaners can be resolved. It uses ultra-high frequency to convert kinetic energy in the liquid medium, produces cavitation effect, forms countless tiny bubbles, and then hits the surface of the object to make the surface dirt fall off, and then achieves the effect of cleaning. Because it passes through the liquid, as long as the liquid can touch the surface of the surface, it can be cleaned in place without leaving any dead ends.

It works on every surface of multiple objects together. This is very useful and quick, capable of cleaning in about 15 minutes. One of the advantages of using ultrasonic cleaning is that it can effectively restore, improve the capacity of pads and components, and reduce electromagnetic interference.

The above is what is the electronic welding of SMT patch summarized by the smt chip processing manufacturers in the actual production? And the introduction of welding and disassembly skills. We hope that our sharing will be helpful to you!