Chips are also called microcircuits, microchips, and integrated circuits (IC). Refers to silicon chips containing integrated circuits, which are small in size and are often part of computers or other electronic equipment. As a hot topic in recent years, chips have been paid more and more attention by the people. As an electronic SMT patch processing manufacturer, it can be said that we touch chips every day, but how are chips manufactured?

1. Silicon purification manufacturing wafers

Purify the sand through related processing techniques, and then obtain simple silicon through a series of procedures, and then make silicon crystal rods with high purity. Silicon ingot is the material of quartz semiconductor for manufacturing integrated circuits, and its slice is the wafer required by chip manufacturing. Silicon wafers are the substrates for chip production. Silicon ingots are mechanically cut into thin silicon circles to facilitate subsequent etching of integrated circuit chips.

2. Wafer coating

Wafer coating film can resist oxidation and temperature resistance, and its material is a kind of photoresist.

3. Wafer photolithography development and etching

The process uses UV-sensitive chemicals that soften when exposed to UV light. The shape of the chip can be obtained by manipulating the position of the light shield. A silicon wafer is coated with a photoresist that dissolves when exposed to ultraviolet light. It is possible to apply the first shade so that the part exposed to the direct UV light is dissolved, and this dissolved part can then be washed away with a solvent. This leaves the rest of the shape the same as the shade, which is exactly what we want. In this way, the silicon dioxide layer we need is obtained.

4. Adding impurities

This process is to implant ions into the wafer to generate corresponding P and N semiconductors. The specific process is to start from the exposed area on the silicon wafer and put it into the chemical ion mixture. The process changes the way doped regions conduct electricity so that each transistor can be turned on, off, or carry data. Simple chips can use only one layer, but complex chips usually have many layers. At this time, this process is repeated continuously, and different layers can be connected by opening windows. This is similar to the manufacturing principle of the layered PCB board. More complex chips may require multiple silicon dioxide layers, which are achieved by repeating photolithography and the above process to form a three-dimensional structure.

5. Wafer test

After going through the above several processes, grid-shaped grains are formed on the wafer. The electrical characteristics of each grain are tested by needle testing. Generally, the number of grains owned by each chip is huge, and it is a very complicated process to design a needle test mode, which requires mass production of models with the same chip standard structure as much as possible during production. The larger the quantity, the lower the relative cost, which is also a factor why the cost of mainstream chip devices is low.

6. Chip packaging

Fix the finished crystal wafer, bind the pins, and manufacture it into various packaging methods according to the needs. This is the reason why the same chip core can have different packaging methods. For example: DIP, QFP, PLCC, QFN and so on. This is mainly determined by peripheral factors such as the user's usage habits, usage environment, and shopping malls.

7. Testing and packaging

After going through the above process, the chip manufacturing has been completed. This process is to test the chip, eliminate defective products, and package.

The above is what is the electronic welding of SMT patch summarized by the smt chip processing manufacturers in the actual production? And the introduction of welding and disassembly skills. We hope that our sharing will be helpful to you!